Patent Assignment Details
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| Reel/Frame: | 010543/0339 | |
| Pages: | 3 |
| | Recorded: | 11/30/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/02/2003
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Application #:
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09445022
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Filing Dt:
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11/30/1999
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Publication #:
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Pub Dt:
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07/31/2003
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Title:
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DIE-BONDING SOLDER MATERIALS
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Assignee
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| 12-19, SHIBUYA 2-CHOME, SHIBUYAKU |
| TOKYO, JAPAN 150-8 |
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Correspondence name and address
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BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN
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GEORGE W HOOVER
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12400 WILSHIRE BOULEVARD, 7TH FLOOR
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LOS ANGELES, CA 90025
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