Patent Assignment Details
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| Reel/Frame: | 010551/0342 | |
| Pages: | 3 |
| | Recorded: | 01/27/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/04/2003
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Application #:
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09490627
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Filing Dt:
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01/24/2000
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Title:
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PHOTOSENTIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND PROCESSES FOR PRODUCING A PRINTED WIRING BOARD, A SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR DEVICE
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Assignees
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| 2-1, HIROSAWA, WAKO-SHI |
| SAITAMA 351-0198, JAPAN |
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME |
| SHINAGAWA-KU, TOKYO 140-0002, JAPAN |
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN & ETAL
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DOROTHY DEFRANCESCO
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767 THIRD AVENUE, 25TH FLOOR
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NEW YORK, NEW YORK 10017-2023
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