Patent Assignment Details
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| Reel/Frame: | 010596/0983 | |
| Pages: | 2 |
| | Recorded: | 02/29/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/26/2001
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Application #:
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09516025
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Filing Dt:
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02/29/2000
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Title:
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Multichip module having a stacked chip arrangement
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Assignee
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| NANTZE EXPORT PROCESSING ZONE |
| NO. 26, CHIN 3RD. ROAD |
| KAOSHIUNG, TAIWAN R.O.C |
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Correspondence name and address
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LOWE HAUPTMAN GOPSTEIN ET AL.
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BENJAMIN J. HAUPTMAN
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1700 DIAGONAL ROAD, SUITE 310
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ALEXANDRIA, VA 22314
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