Patent Assignment Details
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| Reel/Frame: | 010607/0189 | |
| Pages: | 4 |
| | Recorded: | 03/13/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/14/2004
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Application #:
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09467253
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Filing Dt:
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12/20/1999
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Title:
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WIRE BONDING METHOD FOR COPPER INTERCONNECTS IN SEMICONDUCTOR DEVICES
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Assignee
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| 600 MOUNTAIN AVENUE |
| MURRAY HILL, NEW JERSEY 07974 |
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Correspondence name and address
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DARBY & DARBY P.C.
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YA-CHIAO CHANG
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805 THIRD AVENUE
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27TH FLOOR
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NEW YORK, NY 10022-7513
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