Patent Assignment Details
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Reel/Frame: | 010767/0064 | |
| Pages: | 3 |
| | Recorded: | 04/25/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/12/2002
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Application #:
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09557344
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Filing Dt:
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04/25/2000
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Title:
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Semiconductor package and method for making the same
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Assignee
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26, CHIN 3RD RD., 811, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C |
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Correspondence name and address
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J.C. PATENTS, INC.
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JIAWEI HUANG
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1340 REYNOLDS AVE., SUITE 114
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IRVINE, CA 92614
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