Patent Assignment Details
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| Reel/Frame: | 010782/0026 | |
| Pages: | 3 |
| | Recorded: | 05/11/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/25/2001
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Application #:
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09499466
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Filing Dt:
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02/07/2000
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Title:
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Method of dividing a wafer and method of manufacturing a semiconductor device
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Assignee
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| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, ET AL.
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RICHARD V. BURGUJIAN
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1300 I STREET, NW
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WASHINGTON, DC 20005-3315
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