Patent Assignment Details
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| Reel/Frame: | 010825/0018 | |
| Pages: | 4 |
| | Recorded: | 05/17/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/06/2004
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Application #:
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09573463
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Filing Dt:
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05/17/2000
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Title:
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METHOD OF PROCESSING SEMICONDUCTOR WAFER AND SEMICONDUCTOR WAFER SUPPORTING MEMBER
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Assignee
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| 23-23, HONCHO, ITABASHI-KU |
| TOKYO 173-0001, JAPAN |
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Correspondence name and address
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WEBB, ZIESENHEIM, LOGSDON, ET AL.
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KENT E. BALDAUF
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700 KOPPERS BUILDING
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436 SEVENTH AVENUE
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PITTSBURGH, PA 15219-1818
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