Patent Assignment Details
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| Reel/Frame: | 010858/0841 | |
| Pages: | 4 |
| | Recorded: | 05/31/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/23/2002
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Application #:
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09583514
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Filing Dt:
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05/31/2000
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Title:
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Multilevel copper interconnects with low-k dielectrics and air gaps
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Assignee
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83716 |
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Correspondence name and address
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SCHWEGMAN, LUNDBERG, WOESSNER & KLUTH
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EDWARD J. BROOKS, III
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P.O. BOX 2938
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MINNEAPOLIS, MN 55402
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