Patent Assignment Details
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| Reel/Frame: | 010874/0120 | |
| Pages: | 3 |
| | Recorded: | 06/14/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/12/2002
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Application #:
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09593669
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Filing Dt:
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06/14/2000
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Title:
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Method of manufacturing a semiconductor device having copper interconnects
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Assignee
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| P.O. BOX 3453 |
| ONE AMD PLACE |
| SUNNYVALE, CALIFORNIA 94088 |
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Correspondence name and address
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HARRITY & SNYDER, L.L.P.
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GLENN SNYDER
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3900 N. FAIRFAX DRIVE, SUITE 300
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ARLINGTON, VIRGINIA 22203
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