Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 010884/0379 | |
| Pages: | 5 |
| | Recorded: | 02/29/2000 | | |
| Conveyance: | (ASSIGNMENT OF ASSIGNOR'S INTEREST) RE-RECORD TO CORRECT THE RECORDATION DATE OF 2/9/00 TO 2/29/00 PREVIOUSLY RECORDED AT REEL 10657 FRAME 0377 |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/04/2001
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Application #:
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09515849
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Filing Dt:
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02/29/2000
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Title:
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Method of resin-encapsulating semiconductor chip and mold-releasing film used for the method
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Assignee
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| 1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI |
| OSAKA, JAPAN |
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Correspondence name and address
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SUGHRUE, MION ET AL
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MARK BOLAND
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, D.C. 20037-3202
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