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Total properties:
27
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Patent #:
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Issue Dt:
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01/01/1991
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Application #:
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05879773
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Filing Dt:
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02/21/1978
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Title:
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PROCESS AND COMPOSITION FOR SENSITIZING ARTICLES FOR METALLIZATION
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Patent #:
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Issue Dt:
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05/31/1988
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Application #:
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05879774
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Filing Dt:
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02/21/1978
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Title:
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PROCESS AND COMPOSITION FOR SENSITIZING ARTICLES FOR METALLIZATION
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Patent #:
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Issue Dt:
|
05/22/1984
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Application #:
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06080488
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Filing Dt:
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10/01/1979
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Title:
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PROCESS FOR SENSITIZING ARTICLES FOR METALLIZATION AND RESULTING ARTICLES
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Patent #:
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Issue Dt:
|
11/17/1981
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Application #:
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06191068
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Filing Dt:
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09/26/1980
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Title:
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ELECTROLESS COPPER DEPOSITION PROCESS HAVING FASTER PLATING RATES
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Patent #:
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Issue Dt:
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07/13/1982
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Application #:
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06223944
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Filing Dt:
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01/12/1981
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Title:
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RADIATION STRESS RELIEVING OF SULFONE POLYMER ARTICLES
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Patent #:
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Issue Dt:
|
07/05/1983
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Application #:
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06344801
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Filing Dt:
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02/01/1982
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Title:
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PASSIVATION OF METALLIC EQUIPMENT SURFACES IN ELECTROLESS COPPER DEPOSITION PROCESSES
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Patent #:
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Issue Dt:
|
02/07/1984
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Application #:
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06358226
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Filing Dt:
|
03/15/1982
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Title:
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METHOD OF PRODUCING PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
|
06/11/1985
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Application #:
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06365476
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Filing Dt:
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04/05/1982
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Title:
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POLYMERIC SUBSTRATES FOR ELECTROLESS METAL DEPOSITION
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Patent #:
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Issue Dt:
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01/03/1984
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Application #:
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06380999
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Filing Dt:
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05/21/1982
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Title:
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RADIATION STRESS RELIEVING OF POLYMER ARTICLES
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Patent #:
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|
Issue Dt:
|
02/24/1987
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Application #:
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06452536
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Filing Dt:
|
12/23/1982
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Title:
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METHOD FOR MANUFACTURING TWO-SIDED CIRCUIT BOARD
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|
|
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Patent #:
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Issue Dt:
|
07/03/1984
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Application #:
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06485399
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Filing Dt:
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04/15/1983
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Title:
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PROCESS FOR PRODUCING PRINTED CIRCUIT BOARDS
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|
|
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Patent #:
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|
Issue Dt:
|
04/16/1985
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Application #:
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06541048
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Filing Dt:
|
10/12/1983
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Title:
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METHOD FOR DEPOSITING A METAL ON A SURFACE
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|
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Patent #:
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Issue Dt:
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05/26/1987
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Application #:
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06646978
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Filing Dt:
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09/04/1984
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Title:
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IMPROVED BSYSTEM FOR SELECTIVE METALLIZATION OF ELECTRONIC INTERCONNECTION BOARDS
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Patent #:
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Issue Dt:
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06/10/1986
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Application #:
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06665952
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Filing Dt:
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10/29/1984
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Title:
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PROCESS FOR THE PHOTOSELECTIVE METALLIZATION ON NON-CONDUCTIVE PLASTIC BASE MATERIALS
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|
|
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Patent #:
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Issue Dt:
|
03/21/1989
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Application #:
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06926362
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Filing Dt:
|
10/31/1986
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Title:
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CONTROL OF ELECTROLESS PLATING BATHS
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|
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Patent #:
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Issue Dt:
|
06/06/1989
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Application #:
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06928673
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Filing Dt:
|
11/07/1986
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Title:
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PROCESS FOR PRODUCING CONDUCTOR PATTERNS ON THREE DIMENSIONAL ARTICLES
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Patent #:
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Issue Dt:
|
03/13/1990
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Application #:
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07187821
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Filing Dt:
|
04/29/1988
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Title:
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METHOD OF CONSISTENTLY PRODUCING A COPPER DEPOSIT ON A SUBSTRATE BY ELECTROLESS DEPOSITION WHICH DEPOSIT IS ESSENTIALLY FREE OF FISSURES
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|
|
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Patent #:
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Issue Dt:
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10/10/1989
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Application #:
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07216927
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Filing Dt:
|
07/08/1988
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|
Title:
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COMPONENT-CARRYING ADAPTER FOR CHIP CARRIER SOCKET
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|
|
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Patent #:
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Issue Dt:
|
06/19/1990
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Application #:
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07287764
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Filing Dt:
|
12/21/1988
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Title:
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MOLDED CIRCUIT BOARD WITH BURIED CIRCUIT LAYER
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|
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Patent #:
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Issue Dt:
|
10/03/1989
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Application #:
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07288047
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Filing Dt:
|
12/21/1988
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Title:
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MOLDED CIRCUIT BOARD FOR RIBBON CABLE CONNECTOR
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Patent #:
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Issue Dt:
|
09/10/1991
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Application #:
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07314250
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Filing Dt:
|
02/21/1989
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Title:
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PROCESS FOR THE PRODUCTION OF METAL CLAD THERMOPLASTIC BASE MATERIALS AND PRINTED CIRCUITS ON THERMOPLASTIC BASE MATERIAL
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|
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Patent #:
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|
Issue Dt:
|
05/01/1990
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Application #:
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07336950
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Filing Dt:
|
04/13/1989
|
|
Title:
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MOLDED COMPLAINT SPRINGS
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Patent #:
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|
Issue Dt:
|
04/28/1992
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Application #:
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07404262
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Filing Dt:
|
09/07/1989
|
|
Title:
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METHOD OF DESIGNING THREE DIMENSIONAL ELECTRICAL CIRCUITS
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|
|
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Patent #:
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|
Issue Dt:
|
08/16/1994
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Application #:
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07979481
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Filing Dt:
|
11/20/1992
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|
Title:
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PRINTED CIRCUITS AND BASE MATERIALS PRECATALYZED FOR METAL DEPOSITION
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|
|
|
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Patent #:
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|
Issue Dt:
|
02/08/1994
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Application #:
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08005190
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Filing Dt:
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01/14/1993
|
|
Title:
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PORTABLE ELECTRONIC DEVICE AND A METHOD FOR PROCESSING DATA THEREFORE
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|
|
|
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Patent #:
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|
Issue Dt:
|
04/18/1995
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Application #:
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08088909
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Filing Dt:
|
07/08/1993
|
|
Title:
|
PROCESS FOR MAKING METALLIZED PLASTIC ARTICLES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
07/04/1995
|
Application #:
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08144823
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Filing Dt:
|
10/28/1993
|
|
Title:
|
ELECTROLESS COPPER DEPOSITION
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