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Patent Assignment Details
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Reel/Frame:010906/0911   Pages: 3
Recorded: 06/15/2000
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/15/2002
Application #:
09527804
Filing Dt:
03/17/2000
Title:
Method and system of manufacturing slurry for polishing, and method and system of manufacturing semiconductor devices
Assignors
1
Exec Dt:
05/19/2000
2
Exec Dt:
04/24/2000
Assignees
1
72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI
KANAGAWA-KEN 210-8520, JAPAN
2
11-24, TSUKIJI 2-CHOME, CHUO-KU
TOKYO 104-8410, JAPAN
Correspondence name and address
OBLON, SPIVAK, MCCLELLAND MAIER ET AL
FREDERICK D. VASTINE
FOURTH FLOOR
1755 JEFFERSON DAVIS HIGHWAY
ARLINGTON, VIRGINIA 22202

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