Patent Assignment Details
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| Reel/Frame: | 010919/0967 | |
| Pages: | 2 |
| | Recorded: | 06/16/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/19/1991
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Application #:
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07375708
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Filing Dt:
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07/05/1989
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Title:
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HYBRID INTEGRATED CIRCUIT PACKAGE STRUCTURE
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Assignee
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| 711 AZA SHARIDEN, OAZA KURITA |
| NAGANO-SHI, NAGANO 380-0921, JAPAN |
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Correspondence name and address
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RANDY W. LACASSE
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2001 JEFFERSON DAVIS HWY., SUITE 806
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ARLINGTON, VIRGINIA 22202
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