Patent Assignment Details
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Reel/Frame: | 010930/0885 | |
| Pages: | 5 |
| | Recorded: | 07/07/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/22/2002
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Application #:
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09612564
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Filing Dt:
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07/07/2000
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Title:
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Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads
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Assignee
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60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
SINGAPORE 738406, SINGAPORE |
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Correspondence name and address
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GEORGE O. SAILE
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20 MCINTOSH DRIVE
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POUGHKEEPSIE, NY 12603
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