Patent Assignment Details
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| Reel/Frame: | 010954/0502 | |
| Pages: | 3 |
| | Recorded: | 07/20/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/12/2003
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Application #:
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09621134
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Filing Dt:
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07/20/2000
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Title:
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BONDING METHOD AND BONDING STRUCTURE OF THERMOPLASTIC RESIN MATERIAL
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Assignee
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| KARIYA-CITY |
| 1-1, SHOWA-CHO |
| AICHI-PREF, JAPAN 448-8 |
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Correspondence name and address
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LAW OFFICE OF DAVID G. POSZ
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DAVID G. POSZ
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601 PENNSYLVANIA AVENUE, NW
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SUITE 900, SOUTH BUILDING
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WASHINGTON, D.C. 20004
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