Patent Assignment Details
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Reel/Frame: | 010965/0070 | |
| Pages: | 3 |
| | Recorded: | 06/27/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/02/2001
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Application #:
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09604356
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Filing Dt:
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06/27/2000
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Title:
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Method for manufacturing silicon compound having substituents bonded to silicon atoms via si-c bonds
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Assignee
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4TH FLOOR AIG BUILDING, 1-1-3, MARUNOUCHI |
CHIYODA-KU, TOKYO 100-005, JAPAN |
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Correspondence name and address
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DOW CORNING CORPORATION
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ATTN: MELVIN FLETCHER
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INTELLECTUAL PROPERTY DEPT.-MAIL CO1232
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2200 W. SALZBURG ROAD P.O. BOX 994
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MIDLAND, MI 48686
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