Patent Assignment Details
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| Reel/Frame: | 010993/0647 | |
| Pages: | 5 |
| | Recorded: | 07/13/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/21/2002
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Application #:
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09615811
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Filing Dt:
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07/13/2000
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Title:
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Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique
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Assignee
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| 60 WOODLANDS INDUSTRIAL PARK D, STREET 2 |
| SINGAPORE, SINGAPORE 73840 |
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Correspondence name and address
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GEORGE O. SAILE
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20 MCINTOSH DRIVE
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POUGHKEEPSIE, NY 12603
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