Patent Assignment Details
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| Reel/Frame: | 010994/0608 | |
| Pages: | 2 |
| | Recorded: | 08/01/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/15/2002
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Application #:
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09630682
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Filing Dt:
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08/01/2000
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Title:
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Method for manufacturing chip-scale package and manufacturing IC chip
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Assignee
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| SHINJUKU-KU |
| 1-1, NISHI-SHINJUKU 2-CHOME, |
| TOKYO, JAPAN |
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Correspondence name and address
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KANESAKA & TAKEUCHI
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MANABU KANESAKA
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1423 POWHATAN STREET
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ALEXANDRIA, VA 22314
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