Patent Assignment Details
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Reel/Frame: | 010994/0853 | |
| Pages: | 4 |
| | Recorded: | 09/04/2000 | | |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNOR, FILED ON 10/20/1999 RECORDED ON REEL 10341 FRAME 0119 ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/21/2001
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Application #:
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09421247
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Filing Dt:
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10/20/1999
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Title:
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METHOD OF FORMING A LANDING PAD ON A SEMICONDUCTOR WAFER
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Assignee
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 3, LI-HSIN ROAD 2 |
HSIN-CHU, TAIWAN R.O.C |
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Correspondence name and address
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WINSTON HSU
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3F, NO. 52 LANE 46, MING-SHENG RD.
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234 YUNGHO CITY
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TAIPEI HSIEN, TAIWAN, R.O.C.
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