Patent Assignment Details
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| Reel/Frame: | 011033/0139 | |
| Pages: | 2 |
| | Recorded: | 08/14/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/03/2003
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Application #:
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09622203
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Filing Dt:
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08/14/2000
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Title:
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METHOD FOR THERMALLY ANNEALING SILICON WAFER AND SILICON WAFER
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Assignee
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| CHIYODA-KU |
| 4-2, MARUNOUCHI 1-CHOME |
| TOKYO, JAPAN |
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Correspondence name and address
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OLIFF & BERRIDGE, PLC
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WILLIAM P. BERRIDGE
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PO BOX 19928
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ALEXANDRIA, VA 22320
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