Patent Assignment Details
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Reel/Frame: | 011134/0035 | |
| Pages: | 4 |
| | Recorded: | 09/22/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/16/2003
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Application #:
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09667885
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Filing Dt:
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09/22/2000
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Title:
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SILICON WAFER, AND MANUFACTURING METHOD AND HEAT TREATMENT METHOD OF THE SAME
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Assignee
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5-1, OHTEMACHI 1-CHOME, CHIYODA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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REED SMITH SHAW & MCCLAY LLP
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JULES E. GOLDBERG, ESQ.
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261 MADISON AVENUE
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NEW YORK, NY 10016-2391
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