Patent Assignment Details
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Reel/Frame: | 011140/0994 | |
| Pages: | 2 |
| | Recorded: | 09/13/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/22/2001
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Application #:
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09646050
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Filing Dt:
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09/13/2000
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Title:
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Heat-expandable microcapsules and method of utilizing the same
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Assignee
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1-3, SHIBUKAWA-CHO 2-CHOME, YAO-SHI |
OSAKA, 581-0075, JAPAN |
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Correspondence name and address
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FOLEY & LARDNER
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RICHARD L. SCHWAAB
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WASHINGTON HARBOUR
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3000 K STREET, N.W., SUITE 500
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WASHINGTON, DC 20007-5109
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