Patent Assignment Details
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Reel/Frame: | 011162/0365 | |
| Pages: | 6 |
| | Recorded: | 06/28/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/02/2001
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Application #:
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09582608
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Filing Dt:
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06/28/2000
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Title:
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Lead-free solder alloy
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Assignee
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16-15 ESAKACHO 1-CHOME SUITA-SHI |
OSAKA, JAPAN 564-0 |
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Correspondence name and address
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THOMPSON HINE & FLORY LLP
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THEODORE D. LIENESCH
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2000 COURTHOUSE PLAZA N.E.
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P.O. BOX 8801
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DAYTON, OHIO 45401-8801
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