Patent Assignment Details
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| Reel/Frame: | 011180/0765 | |
| Pages: | 7 |
| | Recorded: | 09/08/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/15/2002
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Application #:
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09657393
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Filing Dt:
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09/08/2000
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR WAFER LEVEL PACKAGE
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Assignee
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| INTELLECTUAL PROPERTY DEPT. |
| 1303 EAST ALGONQUIN DEPT. |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA, INC.
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A. KATE HUFFMAN
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PO BOX 10219
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INTELLECTUAL PROPERTY DEPT., SUITE R3163
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SCOTTSDALE, AZ 85271-0219
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