Patent Assignment Details
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| Reel/Frame: | 011259/0965 | |
| Pages: | 2 |
| | Recorded: | 10/23/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/06/2002
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Application #:
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09694163
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Filing Dt:
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10/23/2000
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Title:
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SILICON WAFER, AND HEAT TREATMENT METHOD OF THE SAME AND THE HEAT-TREATED SILICON WAFER
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Assignee
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| 5-1, OHTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-0 |
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Correspondence name and address
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REED SMITH, LLP
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JULES E. GOLDBERG, ESQ
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375 PARK AVENUE
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NEW YORK, NEW YORK 10152
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