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Patent Assignment Details
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Reel/Frame:011271/0948   Pages: 3
Recorded: 11/01/2000
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/06/2001
Application #:
09519879
Filing Dt:
03/06/2000
Title:
Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing
Assignors
1
Exec Dt:
02/23/2000
2
Exec Dt:
02/23/2000
3
Exec Dt:
02/23/2000
Assignee
1
YOKOHAMA-SHI
2-7-3, MINOWA-CHO, KOHOKU-KU
KANAGAWA 223-8533, JAPAN
Correspondence name and address
OBLON, SPIVAK, MCCLELAND, MAIER ET AL
NORMAN F. OBLON
FOURTH FLOOR
1755 JEFFERSON DAVIS HIGHWAY
ARLINGTON, VIRGINIA 22202

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