Patent Assignment Details
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| Reel/Frame: | 011351/0978 | |
| Pages: | 6 |
| | Recorded: | 11/24/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09721898
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Filing Dt:
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11/24/2000
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Title:
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INTERMETAL DIELECTRIC LAYER FOR INTEGRATED CIRCUITS
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Assignees
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| 60 WOODLANDS INDUSTRIAL PARK D, STREET 2 |
| SINGAPORE 738406, SINGAPORE |
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| 555 UNION BOULEVARD |
| ALLENTOWN, PENNSYLVANIA 18103 |
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Correspondence name and address
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THE LAW OFFICES OF MIKIO ISHIMARU
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MIKIO ISHIMARU
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1046 PINENUT COURT
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SUNNYVALE, CA 94087
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