Patent Assignment Details
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Reel/Frame: | 011375/0410 | |
| Pages: | 4 |
| | Recorded: | 12/14/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/18/2005
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Application #:
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09735548
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Filing Dt:
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12/14/2000
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Publication #:
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Pub Dt:
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08/30/2001
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Title:
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METHOD OF BONDING METAL PLATES, APPARATUS THEREFOR AND HOT STRIP MILL
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Assignees
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2477, TAKABA, HITACHINAKA-SHI |
IBARAKI-KEN, JAPAN |
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1, GOEDONG-DONG |
POHANG-SI, KOREA, REPUBLIC OF |
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32, HYOJA-DONG, NAM-KU |
POHANG CITY KYUNGBUK, KOREA, REPUBLIC OF |
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Correspondence name and address
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EVENSON, MCKEOWN, EDWARDS & LENAHAN PLLC
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DONALD D. EVENSON, ESQ.
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1200 G STREET, N.W.
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SUITE 700
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WASHINGTON, DC 20005-3814
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