Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 011401/0058 | |
| Pages: | 3 |
| | Recorded: | 12/21/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09740874
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Filing Dt:
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12/21/2000
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Publication #:
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Pub Dt:
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06/07/2001
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Title:
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Mold device, electronic apparatus, and electronic apparatus manufacturing method
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Assignees
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| 72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI |
| KANGAWA 210-8572, JAPAN |
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| 1-5, KUMANOCHO, ITABASHI-KU |
| TOKYO 173-0225, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, ET AL.
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ERNEST F. CHAPMAM
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1300 I STREET, N.W.
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WASHINGTON, DC 20005-3315
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