Patent Assignment Details
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| Reel/Frame: | 011432/0721 | |
| Pages: | 2 |
| | Recorded: | 12/21/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09741089
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Filing Dt:
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12/21/2000
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Publication #:
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Pub Dt:
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08/29/2002
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Title:
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Silver-dispersed copper powder, process for producing the powder and conductive paste utilizing the powder
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Assignee
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| 8-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO 100-8282, JAPAN |
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Correspondence name and address
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MCDERMOTT, WILL & EMERY
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ROBERT L. PRICE
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005
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