Patent Assignment Details
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| Reel/Frame: | 011441/0576 | |
| Pages: | 3 |
| | Recorded: | 11/02/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/10/2004
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Application #:
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09705237
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Filing Dt:
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11/02/2000
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Title:
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DIE USED FOR RESIN-SEALING AND MOLDING AN ELECTRONIC COMPONENT
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Assignees
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| MINAMI-KU, KYOTO-SHI |
| 5, KAMITOBA KAMICHOSHI-CHO |
| KYOTO, JAPAN |
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| HIGASHINARI-KU |
| 9-18, HIGASHI-OBASE 1-CHOME |
| OSAKA-SHI, OSAKA, JAPAN |
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Correspondence name and address
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FASSE PATENT ATTORNEY, P.A.
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WALTER F. FASSE
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INDIAN POND LANE
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P.O. BOX K
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ST. ALBANS, ME 04971
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