Patent Assignment Details
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| Reel/Frame: | 011459/0496 | |
| Pages: | 4 |
| | Recorded: | 11/07/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/25/2003
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Application #:
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09706691
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Filing Dt:
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11/07/2000
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Title:
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MOUNTING METHOD OF IC CHIP AND MANUFACTURING METHOD OF HEAD SUSPENSION ASSEMBLY WITH THE IC CHIP
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Assignee
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| 1-13-1, NIHONBASHI, CHUO-KU |
| TOKYO 103-8272, JAPAN |
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Correspondence name and address
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ARMSTRONG WESTERMAN HATTORI, ET AL.
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RONALD F. NAUGHTON
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1725 K STREET, N.W., SUITE 1000
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WASHINGTON, DC 20006
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