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Reel/Frame:011562/0778   Pages: 2
Recorded: 02/22/2001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/13/2003
Application #:
09789490
Filing Dt:
02/22/2001
Publication #:
Pub Dt:
01/10/2002
Title:
METHOD OF DESIGNING A LAYOUT OF AN LSI CHIP, AND A COMPUTER PRODUCT
Assignors
1
Exec Dt:
02/09/2001
2
Exec Dt:
02/09/2001
Assignee
1
NAKAHARA-KU, KAWASAKI-SHI
1-1, KAMIKODANAKA 4-CHOME
KANAGAWA 211-8588, JAPAN
Correspondence name and address
STAAS & HALSEY, LLP
H. J. STAAS
700 ELEVENTH STREET, N.W., SUITE 500
WASHINGTON, DC 20001

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