Patent Assignment Details
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| Reel/Frame: | 011635/0440 | |
| Pages: | 2 |
| | Recorded: | 12/18/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09737768
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Filing Dt:
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12/18/2000
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Publication #:
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Pub Dt:
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06/28/2001
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Title:
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METHOD OF FORMING A RESIN-SEALED SEMICONDUCTOR DEVICE
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Assignee
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| 7-12, TORANOMON 1-CHOME |
| MINATO-KU, TOKYO 105, JAPAN |
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Correspondence name and address
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OKI AMERICA, INC.
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JUNICHI MIMURA
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1101 14TH STREET, N.W., SUITE 555
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WASHINGTON, D.C. 20005
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