Patent Assignment Details
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| Reel/Frame: | 011638/0381 | |
| Pages: | 3 |
| | Recorded: | 03/01/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/06/2003
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Application #:
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09786228
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Filing Dt:
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03/01/2001
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Title:
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SOI SUBSTRATE, METHOD OF MANUFACTURE THEREOF, AND SEMICONDUCTOR DEVICE USING SOI SUBSTRATE
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Assignees
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| 5-1, OHTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO 100-0004, JAPAN |
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| 2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO 100-8310, JAPAN |
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Correspondence name and address
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REED SMITH LLP
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JULES E. GOLDBERG, ESQ.
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375 PARK AVENUE
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NEW YORK, NY 10152
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