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Patent Assignment Details
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Reel/Frame:011646/0305   Pages: 3
Recorded: 04/02/2001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
09736188
Filing Dt:
12/15/2000
Publication #:
Pub Dt:
12/05/2002
Title:
Wafer transfer method performed with vapor thin film growth system and wafer support member used for this method
Assignors
1
Exec Dt:
11/20/2000
2
Exec Dt:
11/20/2000
3
Exec Dt:
11/22/2000
4
Exec Dt:
12/22/2000
5
Exec Dt:
12/20/2000
6
Exec Dt:
12/05/2000
Assignee
1
2-11 GINZA 4-CHOME, CHUUOU-KU
TOKYO, 104-0061, JAPAN
Correspondence name and address
FOLEY & LARDNER
RICHARD L. SCHWAAB
WASHINGTON HARBOUR
3000 K STREET, N.W., SUITE 500
WASHINGTON, D.C. 20007-5109

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