Patent Assignment Details
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| Reel/Frame: | 011653/0558 | |
| Pages: | 3 |
| | Recorded: | 03/22/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/27/2003
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Application #:
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09814789
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Filing Dt:
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03/22/2001
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Publication #:
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Pub Dt:
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09/26/2002
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Title:
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APPARATUS TO REDUCE THERMAL FATIGUE STRESS ON FLIP CHIP SOLDER CONNECTIONS
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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SALZMAN & LEVY
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MARK LEVY
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19 CHENANGO ST., SUITE 902
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BINGHAMTON, NY 13901
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