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Patent Assignment Details
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Reel/Frame:011656/0058   Pages: 3
Recorded: 03/27/2001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/22/2003
Application #:
09817275
Filing Dt:
03/27/2001
Publication #:
Pub Dt:
08/02/2001
Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD PERMITTING SUPPRESSION OF LEAK CURRENT THROUGH THE PN JUNCTION
Assignors
1
Exec Dt:
12/10/1999
2
Exec Dt:
12/10/1999
3
Exec Dt:
12/10/1999
4
Exec Dt:
12/10/1999
5
Exec Dt:
12/10/1999
6
Exec Dt:
12/10/1999
Assignee
1
72 HORIKAWA-CHO, SAIWAI-KU
KAWASAKI-SHI, JAPAN
Correspondence name and address
FINNEGAN, HENDERSON, FARABOW ET AL.
MR. ERNEST F. CHAPMAN
1300 I STREET, N.W.
WASHINGTON, DC 20005-3315

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