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Patent Assignment Details
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Reel/Frame:011672/0853   Pages: 2
Recorded: 04/02/2001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
09824169
Filing Dt:
04/02/2001
Publication #:
Pub Dt:
11/01/2001
Title:
Wiring material and connecting structure of said wiring material
Assignor
1
Exec Dt:
03/21/2001
Assignee
1
1-14 NISHISUEHIRO-CHO
YOKKAICHI-CHO, MIE, JAPAN 510-8
Correspondence name and address
GERALD E. HESPOS
274 MADISON AVENUE SUITE 1703
NEW YORK, NEW YORK 10016

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