Patent Assignment Details
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Reel/Frame: | 011672/0853 | |
| Pages: | 2 |
| | Recorded: | 04/02/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09824169
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Filing Dt:
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04/02/2001
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Publication #:
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Pub Dt:
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11/01/2001
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Title:
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Wiring material and connecting structure of said wiring material
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Assignee
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1-14 NISHISUEHIRO-CHO |
YOKKAICHI-CHO, MIE, JAPAN 510-8 |
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Correspondence name and address
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GERALD E. HESPOS
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274 MADISON AVENUE SUITE 1703
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NEW YORK, NEW YORK 10016
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