Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 011679/0363 | |
| Pages: | 2 |
| | Recorded: | 04/06/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/06/2004
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Application #:
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09749606
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Filing Dt:
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12/28/2000
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Publication #:
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Pub Dt:
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10/11/2001
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Title:
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SOLDER MATERIAL, DEVICE USING THE SAME AND MANUFACTURING PROCESS THEREOF
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Assignee
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| 72 HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI |
| KANAGAWA-KEN, JAPAN |
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Correspondence name and address
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FOLEY & LARDNER
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RICHARD L. SCHWAAB
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WASHINGTON HARBOUR
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3000 K STREET, N.W., SUITE 500
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WASHINGTON, D.C. 20007-5109
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