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Patent #:
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Issue Dt:
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02/02/1993
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Application #:
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07629440
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Filing Dt:
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12/18/1990
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Title:
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METHOD OF PRODUCING A STRIP OF LEAD FRAMES FOR INTEGRATED CIRCUIT DIES IN A CONTINUOUS SYSTEM
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Patent #:
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Issue Dt:
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12/14/1993
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Application #:
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07763806
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Filing Dt:
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09/23/1991
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Title:
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SLITTER MACHINE FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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01/09/1996
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Application #:
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07893518
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Filing Dt:
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06/02/1992
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Title:
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INTEGRATED CIRCUIT PACKAGE WITH VIA INTERCONNECTIONS FORMED IN A SUBSTRATE
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Patent #:
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Issue Dt:
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04/19/1994
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Application #:
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07936927
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Filing Dt:
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08/27/1992
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Title:
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METHOD OF AND APPARATUS FOR PRODUCING A STRIP OF LEAD FRAMES FOR INTEGRATED CIRCUIT DIES IN A CONTINUOUS SYSTEM
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Patent #:
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Issue Dt:
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07/12/1994
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Application #:
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07973354
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Filing Dt:
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11/09/1992
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Title:
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METHOD FOR FORMING PLASTIC MOLDED PACKAGE WITH HEAT SINK FOR INTEGRATEDCIRCUIT DEVICES
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Patent #:
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Issue Dt:
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01/03/1995
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Application #:
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08037209
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Filing Dt:
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03/26/1993
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Title:
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INTEGRATED CIRCUIT PACKAGE WITH VIA INTERCONNECTION TECHNIQUES AND METHOD FOR FORMING SUCH A PACKAGE
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Patent #:
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Issue Dt:
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10/11/1994
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Application #:
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08047721
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Filing Dt:
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04/14/1993
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Title:
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BALL GRID ARRAY WITH VIA INTERCONNECTION
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Patent #:
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Issue Dt:
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10/03/1995
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Application #:
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08152935
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Filing Dt:
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11/15/1993
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Title:
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PLASTIC MOLDED PACKAGE WITH HEAT SINK FOR INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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06/03/1997
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Application #:
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08214339
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Filing Dt:
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03/16/1994
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Title:
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MOLD RUNNER REMOVAL FROM A SUBSTRATE-BASED PACKAGED ELECTRONIC DEVICE
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Patent #:
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Issue Dt:
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01/10/1995
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Application #:
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08231341
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Filing Dt:
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04/19/1994
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Title:
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PACKAGED INTEGRATED CIRCUIT INCLUDING HEAT SLUG HAVING AN EXPOSED SURFACE
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Patent #:
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Issue Dt:
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12/23/1997
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Application #:
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08237709
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Filing Dt:
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05/03/1994
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Title:
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PACKAGED SEMICONDUCTOR DIE INCLUDING HEAT SINK WITH LOCKING FEATURE
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Patent #:
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Issue Dt:
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12/26/1995
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Application #:
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08241427
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Filing Dt:
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05/11/1994
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Title:
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METHOD FOR INTERCONNECTION OF INTEGRATED CIRCUIT CHIP AND SUBSTRATE
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Patent #:
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Issue Dt:
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12/10/1996
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Application #:
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08245146
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Filing Dt:
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05/16/1994
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Title:
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BALL GRID ARRAY INTEGRATED CIRCUIT PACKAGE WITH THERMAL CONDUCTOR
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Patent #:
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Issue Dt:
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01/09/1996
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Application #:
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08286153
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Filing Dt:
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08/04/1994
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Title:
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METHOD AND APPARATUS FOR APPLYING FLUX TO BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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10/27/1998
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Application #:
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08339329
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Filing Dt:
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11/14/1994
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Title:
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HOMOGENEOUS CHIP CARRIER PACKAGE
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Patent #:
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Issue Dt:
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12/10/1996
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Application #:
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08357284
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Filing Dt:
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12/13/1994
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Title:
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CONTINUOUS SELF-CLEANING FILTRATION UNIT
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Patent #:
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Issue Dt:
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07/22/1997
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Application #:
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08383966
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Filing Dt:
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02/06/1995
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Title:
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THERMALLY ENHANCED CHIP CARRIER PACKAGE
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Patent #:
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Issue Dt:
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01/21/1997
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Application #:
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08405462
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Filing Dt:
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03/16/1995
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Title:
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PLASTIC PACKAGED INTEGRATED CIRCUIT WITH HEAT SPREADER
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Patent #:
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Issue Dt:
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01/16/1996
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Application #:
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08410381
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Filing Dt:
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03/27/1995
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Title:
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SEMICONDUCTOR DEVICE HAVING A THERMAL DISSIPATOR AND ELECTROMAGNETIC SHIELDING
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Patent #:
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Issue Dt:
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01/09/1996
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Application #:
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08411010
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Filing Dt:
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03/27/1995
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Title:
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METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING A THERMAL DISSIPATOR AND ELECTROMAGNETIC SHIELDING
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Patent #:
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Issue Dt:
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03/03/1998
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Application #:
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08520429
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Filing Dt:
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08/29/1995
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Title:
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SEMICONDUCTOR LEAD FRAME HAVING CONNECTION BAR AND GUIDE RINGS
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Patent #:
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Issue Dt:
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01/27/1998
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Application #:
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08530558
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Filing Dt:
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09/19/1995
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Title:
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METHOD FOR CHECKING A WIRE BOND OF A SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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05/13/1997
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Application #:
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08570794
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Filing Dt:
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12/12/1995
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Title:
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SEMICONDUCTOR PACKAGE WITH INTEGRAL HEAT DISSIPATOR
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Patent #:
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Issue Dt:
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04/21/1998
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Application #:
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08570849
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Filing Dt:
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12/12/1995
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Title:
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BONDING METHOD FOR SEMICONDUCTOR CHIPS
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Patent #:
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Issue Dt:
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08/26/1997
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Application #:
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08571316
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Filing Dt:
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12/12/1995
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Title:
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CHIP MOUNTING PLATE CONSTRUCTION OF LEAD FRAME FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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03/17/1998
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Application #:
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08588172
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Filing Dt:
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01/18/1996
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Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION AND DEHUMIDIFICATION EFFECT
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Patent #:
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Issue Dt:
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06/24/1997
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Application #:
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08588482
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Filing Dt:
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01/18/1996
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Title:
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METHOD AND CIRCUIT BOARD STRUCTURE FOR LEVELING SOLDER BALLS IN BALL GRID ARRAY SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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01/12/1999
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Application #:
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08637578
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Filing Dt:
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04/24/1996
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Title:
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CARRIER STRIP AND MOLDED FLEX CIRCUIT BALL GRID ARRAY
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Patent #:
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Issue Dt:
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12/29/1998
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Application #:
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08637877
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Filing Dt:
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04/24/1996
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Title:
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METHOD OF MAKING GRID ARRAY ASSEMBLY
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Patent #:
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Issue Dt:
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03/03/1998
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Application #:
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08641603
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Filing Dt:
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05/01/1996
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Title:
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METHOD OF MAKING A PACKAGED SEMICONDUCTOR DIE INCLUDING HEAT SINK WITH LOCKING FEATURE
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Patent #:
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Issue Dt:
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12/29/1998
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Application #:
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08651200
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Filing Dt:
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05/17/1996
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Title:
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UNIT PRINTED CIRCUIT BOARD CARRIER FRAME FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING BALL GRID ARRAY SEMICONDUCTOR PACKAGES USING THE SAME
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Patent #:
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Issue Dt:
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09/30/1997
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Application #:
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08688083
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Filing Dt:
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07/29/1996
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Title:
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INTERDIGITATED WIREBOND PROGRAMMABLE FIXED VOLTAGE PLANES
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Patent #:
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Issue Dt:
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06/02/1998
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Application #:
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08693362
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Filing Dt:
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08/06/1996
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Title:
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POWER DRAWING CIRCUIT FOR TWO-WIRE SWITCHING UNIT
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Patent #:
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Issue Dt:
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11/17/1998
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Application #:
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08704477
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Filing Dt:
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08/28/1996
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Title:
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WAFER MAP CONVERSION METHOD
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Patent #:
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Issue Dt:
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09/15/1998
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Application #:
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08707381
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Filing Dt:
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09/04/1996
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Title:
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METHOD FOR FABRICATING A HEAT SINK-INTEGRATED SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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06/10/1997
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Application #:
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08729540
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Filing Dt:
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10/11/1996
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Title:
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METHOD FOR MOLDING OF INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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06/16/1998
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Application #:
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08736107
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Filing Dt:
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10/24/1996
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Title:
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PRINTED CIRCUIT BOARD HAVING EPOXY BARRIER AROUND A THROUGHOUT SLOT AND BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
11/09/1999
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Application #:
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08741797
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Filing Dt:
|
10/31/1996
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Title:
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NEAR CHIP SIZE INTEGRATED CIRCUIT PACKAGE
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Patent #:
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|
Issue Dt:
|
11/03/1998
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Application #:
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08748752
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Filing Dt:
|
11/14/1996
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Title:
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SOCKET ASSEMBLY FOR INTEGRATED CIRCUIT CHIP CARRIER PACKAGE
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Patent #:
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Issue Dt:
|
01/13/1998
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Application #:
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08748937
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Filing Dt:
|
11/13/1996
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|
Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH RING-TYPE HEAT SINK
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Patent #:
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|
Issue Dt:
|
12/29/1998
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Application #:
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08749450
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Filing Dt:
|
11/15/1996
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|
Title:
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SEMICONDUCTOR PACKAGE INCLUDING HEAT SINK WITH LAYERED CONDUCTIVE PLATE AND NON-CONDUCTIVE TAPE BONDING TO LEADS
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Patent #:
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|
Issue Dt:
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01/12/1999
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Application #:
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08749578
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Filing Dt:
|
11/14/1996
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|
Title:
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PROCESS FOR BONDING SEMICONDUCTOR CHIP
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Patent #:
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|
Issue Dt:
|
08/18/1998
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Application #:
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08761472
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Filing Dt:
|
12/06/1996
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|
Title:
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INTEGRATED CIRCUIT CHIP TO SUBSTRATE INTERCONNECTION AND METHOD
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|
|
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Patent #:
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|
Issue Dt:
|
01/12/1999
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Application #:
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08763605
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Filing Dt:
|
12/11/1996
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|
Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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|
|
|
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Patent #:
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|
Issue Dt:
|
05/18/1999
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Application #:
|
08775212
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Filing Dt:
|
12/31/1996
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|
Title:
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BALL GIRD ARRAY SEMICONDUCTOR PACKAGE USING A METAL CARRIER RING AS A HEAT SPREADER
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Patent #:
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|
Issue Dt:
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02/02/1999
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Application #:
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08775839
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Filing Dt:
|
12/31/1996
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Title:
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GRID ARRAY TYPE LEAD FRAME AND LEAD END GRID ARRAY SEMICONDUCTOR PACKAGE EMPLOYING THE SAME
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Patent #:
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Issue Dt:
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06/22/1999
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Application #:
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08777927
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Filing Dt:
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12/23/1996
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Title:
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SEMICONDUCTOR CHIP SCALE PACKAGE AND METHOD OF PRODUCING SUCH
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Patent #:
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|
Issue Dt:
|
06/01/1999
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Application #:
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08813725
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Filing Dt:
|
03/07/1997
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Title:
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METHOD OF FORMING CHIP BUMPS OF BUMP CHIP SCALE SEMICONDUCTOR PACKAGE
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Patent #:
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|
Issue Dt:
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02/16/1999
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Application #:
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08825945
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Filing Dt:
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04/01/1997
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Title:
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SOLDER BALL LAND METAL STRUCTURE OF BALL GRID SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
03/07/2000
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Application #:
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08844536
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Filing Dt:
|
04/18/1997
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Title:
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INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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08844543
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Filing Dt:
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04/18/1997
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Title:
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EXHAUST CONTROL FOR WATERCRAFT ENGINE
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Patent #:
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Issue Dt:
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08/18/1998
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Application #:
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08862687
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Filing Dt:
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05/23/1997
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Title:
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SOLDER BALL JOINT
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Patent #:
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Issue Dt:
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11/09/1999
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Application #:
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08882248
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Filing Dt:
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06/25/1997
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Title:
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PRINTED CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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02/08/2000
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Application #:
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08882687
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Filing Dt:
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06/25/1997
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Title:
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MARKING BAD PRINTED CIRCUIT BOARDS FOR SEMICONDUCTOR PACKAGES
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Patent #:
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|
Issue Dt:
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01/26/1999
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Application #:
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08883541
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Filing Dt:
|
06/25/1997
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Title:
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FLEXIBLE CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
09/14/1999
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Application #:
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08915077
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Filing Dt:
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08/20/1997
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Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH SOLDER BALLS FUSED ON PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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08/17/1999
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Application #:
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08925915
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Filing Dt:
|
09/09/1997
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Title:
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SHIELDED SURFACE ACOUSTICAL WAVE PACKAGE
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Patent #:
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Issue Dt:
|
02/02/1999
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Application #:
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08926495
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Filing Dt:
|
09/09/1997
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|
Title:
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MOUNTING FOR A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
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Patent #:
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Issue Dt:
|
10/05/1999
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Application #:
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08926507
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Filing Dt:
|
09/09/1997
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|
Title:
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INTEGRATED CIRCUIT PACKAGE EMPLOYING A TRANSPARENT ENCAPSULANT
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|
|
|
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Patent #:
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|
Issue Dt:
|
10/26/1999
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Application #:
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08934315
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Filing Dt:
|
09/19/1997
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|
Title:
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MOLD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
11/16/1999
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Application #:
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08942784
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Filing Dt:
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10/02/1997
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Title:
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SEMICONDUCTOR PACKAGE HAVING LIGHT, THIN, SIMPLE AND COMPACT STRUCTURE
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Patent #:
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Issue Dt:
|
02/22/2000
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Application #:
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08949585
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Filing Dt:
|
10/14/1997
|
|
Title:
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A MICROELECTRONIC DEVICE PACKAGE HAVING A HEAT SINK STRUCTURE FOR INCREASING THE THERMAL CONDUCTIVITY OF THE PACKAGE
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Patent #:
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Issue Dt:
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04/27/1999
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Application #:
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08951062
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Filing Dt:
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10/15/1997
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Title:
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METHOD FOR REPRODUCING PRINTED CIRCUIT BOARDS FOR SEMICONDUCTOR PACKAGES INCLUDING POOR QUALITY PRINTED CIRCUIT BOARD UNITS AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES USING THE REPRODUCED PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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04/13/1999
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Application #:
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08951890
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Filing Dt:
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10/16/1997
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Title:
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A METHOD FOR MANUFACTURING AN ALUMINA-SILICON CARBIDE NANOCOMPOSITE
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Patent #:
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Issue Dt:
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11/02/1999
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Application #:
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09008552
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Filing Dt:
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01/16/1998
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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02/01/2000
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Application #:
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09013330
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Filing Dt:
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01/26/1998
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Title:
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METHOD OF MANUFACTURING BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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05/21/2002
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Application #:
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09024940
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Filing Dt:
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02/17/1998
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Publication #:
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Pub Dt:
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08/23/2001
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Title:
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METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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12/19/2000
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Application #:
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09078377
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Filing Dt:
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05/13/1998
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Title:
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INTEGRATED CIRCUIT CHIP TO SUBSTRATE INTERCONNECTION
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Patent #:
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Issue Dt:
|
11/21/2000
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Application #:
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09083524
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Filing Dt:
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05/22/1998
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Title:
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RF SHIELDED DEVICE
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Patent #:
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Issue Dt:
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09/07/1999
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Application #:
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09085136
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Filing Dt:
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05/26/1998
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Title:
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METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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11/07/2000
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Application #:
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09103760
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Filing Dt:
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06/24/1998
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Title:
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PLASTIC INTEGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
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Patent #:
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|
Issue Dt:
|
09/07/1999
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Application #:
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09118197
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Filing Dt:
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07/17/1998
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Title:
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MOUNTING HAVING AN APERTURE COVER WITH ADHESIVE LOCKING FEATURE FOR FLIP CHIP OPTICAL INTEGRATED CIRCUIT DEVICE
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Patent #:
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Issue Dt:
|
11/16/1999
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Application #:
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09141928
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Filing Dt:
|
08/28/1998
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|
Title:
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METHOD OF MAKING A MOLDED FLEX CIRCUIT BALL GRID ARRAY
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|
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Patent #:
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Issue Dt:
|
09/26/2000
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Application #:
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09161189
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Filing Dt:
|
09/25/1998
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|
Title:
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CARRIER STRIP AND MOLDED FLEX CIRCUIT BALL GRID ARRAY
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Patent #:
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|
Issue Dt:
|
11/07/2000
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Application #:
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09176048
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Filing Dt:
|
10/20/1998
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Title:
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A METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE EMPLOYING A TRANSPARENT ENCAPSULANT
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Patent #:
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Issue Dt:
|
08/28/2001
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Application #:
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09176614
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Filing Dt:
|
10/21/1998
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Title:
|
PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE AND LEADFRAME
HAVING PARTIALLY UNDERCUT LEADS AND DIE PAD
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Patent #:
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Issue Dt:
|
03/27/2001
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Application #:
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09199041
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Filing Dt:
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11/24/1998
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Title:
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METHOD OF FORMING TITANIUM SILICIDE
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Patent #:
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Issue Dt:
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09/05/2000
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Application #:
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09199706
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Filing Dt:
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11/24/1998
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Title:
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METHOD FOR FORMING ISOLATION TRENCHES ON A SEMICONDUCTOR SUBSTRATE
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Patent #:
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Issue Dt:
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11/21/2000
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Application #:
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09203720
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Filing Dt:
|
12/01/1998
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Title:
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GRID ARRAY TYPE LEAD FRAME HAVING LEAD ENDS IN DIFFERENT PLANES
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Patent #:
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Issue Dt:
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12/11/2001
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Application #:
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09203826
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Filing Dt:
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12/01/1998
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Title:
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GRID ARRAY ASSEMBLY OF CIRCUIT BOARDS WITH SINGULATION GROOVES
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Patent #:
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Issue Dt:
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10/17/2000
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Application #:
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09220987
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Filing Dt:
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12/23/1998
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Title:
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METHOD FOR CALIBRATING OPTICAL SENSOR USED TO MEASURE THE
TEMPERATURE OF A SUBSTRATE DURING RAPID THERMAL PROCESS
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Patent #:
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Issue Dt:
|
03/13/2001
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Application #:
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09223236
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Filing Dt:
|
12/30/1998
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Title:
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MOS TRANSISTOR THAT INHIBITS PUNCHTHROUGH AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
|
01/11/2000
|
Application #:
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09223238
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Filing Dt:
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12/30/1998
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Title:
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METHOD FOR FABRICATING AN LDD MOS TRANSISTOR
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Patent #:
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Issue Dt:
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03/20/2001
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Application #:
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09223471
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Filing Dt:
|
12/30/1998
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Title:
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TRENCH STRUCTURE FOR ISOLATING SEMICONDUCTOR ELEMENTS AND METHOD FOR FORMING THE SAME
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Patent #:
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Issue Dt:
|
10/15/2002
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Application #:
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09233980
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Filing Dt:
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01/20/1999
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Title:
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MICROCIRCUIT DIE-SAWING PROTECTOR AND METHOD
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09240422
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Filing Dt:
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01/29/1999
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Title:
|
"PRINTED CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGES"
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Patent #:
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Issue Dt:
|
04/10/2001
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Application #:
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09240423
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Filing Dt:
|
01/29/1999
|
|
Title:
|
METHOD OF MOLDING BALL GRID ARRAY SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
|
06/12/2001
|
Application #:
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09246574
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Filing Dt:
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02/08/1999
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Title:
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ELECTROSTATIC DISCHARGE PROTECTION PACKAGE AND METHOD
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Patent #:
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Issue Dt:
|
06/11/2002
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Application #:
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09261280
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Filing Dt:
|
03/02/1999
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Title:
|
TEST PATTERN FOR MEASURING VARIATIONS OF CRITICAL DIMENSIONS OF WIRING PATTERNS FORMED IN THE FABRICATION OF SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
|
10/02/2001
|
Application #:
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09262789
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Filing Dt:
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03/04/1999
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Title:
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METHOD FOR FORMING A MENTAL WIRING PATTERN ON A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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10/16/2001
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Application #:
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09287711
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Filing Dt:
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04/07/1999
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Title:
|
THIN, STACKABLE SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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07/31/2001
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Application #:
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09305170
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Filing Dt:
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05/04/1999
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Title:
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PRINTED CIRCUIT BOARD WITH OVAL SOLDER BALL LANDS FOR BGA SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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01/08/2002
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Application #:
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09310660
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Filing Dt:
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05/12/1999
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Title:
|
LOW-COST PRINTED CIRCUIT BOARD WITH INTEGRAL HEAT SINK FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
08/14/2001
|
Application #:
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09324710
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Filing Dt:
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06/03/1999
|
|
Title:
|
PLASTIC PACKAGE FOR AN OPTICAL INTEGRATED CIRCUIT DEVICE AND METHOD OF MAKING
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Patent #:
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Issue Dt:
|
05/08/2001
|
Application #:
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09348772
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Filing Dt:
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07/07/1999
|
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Title:
|
NEAR CHIP SIZE INTEGRATED CIRCUIT PACKAGE
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Patent #:
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|
Issue Dt:
|
07/10/2001
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Application #:
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09370600
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Filing Dt:
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08/09/1999
|
|
Title:
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METHOD OF MAKING AN ELECTRONIC DEVICE PACKAGE AND LEADFRAME
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Patent #:
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|
Issue Dt:
|
06/19/2001
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Application #:
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09383022
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Filing Dt:
|
08/25/1999
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Title:
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METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE PACKAGE USING A PLASTIC TAPE AS A BASE
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Patent #:
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|
Issue Dt:
|
07/08/2003
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Application #:
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09385694
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Filing Dt:
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08/30/1999
|
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Title:
|
WAFER-SCALE PRODUCTION OF CHIP-SCALE SEMICONDUCTOR PACKAGES USING WAFER MAPPING TECHNIQUES
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Patent #:
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Issue Dt:
|
09/10/2002
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Application #:
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09385696
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Filing Dt:
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08/30/1999
|
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Title:
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SURFACE ACOUSTICAL WAVE FLIP CHIP
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Patent #:
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Issue Dt:
|
05/29/2001
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Application #:
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09386695
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Filing Dt:
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08/31/1999
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Title:
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ENERGY TRANSFER HYBRIDIZATION ASSAY COMPOSITION
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