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Total properties:
22
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Patent #:
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Issue Dt:
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03/16/1993
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Application #:
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07609163
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Filing Dt:
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11/02/1990
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Title:
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THERMOPLASTIC SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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12/22/1992
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Application #:
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07680340
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Filing Dt:
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04/04/1991
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Title:
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LEAD FRAME WORKHOLDER AND TRANSPORT APPARATUS AND METHOD
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Patent #:
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Issue Dt:
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08/31/1993
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Application #:
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07977523
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Filing Dt:
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11/17/1992
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Title:
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THERMOPLASTIC SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING IT
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Patent #:
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Issue Dt:
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11/28/1995
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Application #:
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08250153
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Filing Dt:
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05/26/1994
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Title:
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HOMOGENEOUS THERMOPLASTIC SEMI-CONDUCTOR CHIP CARRIER PACKAGE
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Patent #:
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Issue Dt:
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01/16/1996
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Application #:
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08345573
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Filing Dt:
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11/28/1994
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Title:
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METHOD OF MAKING HOMOGENEOUS THERMOPLASTIC SEMI-CONDUCTOR CHIP CARRIER PACKAGE
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Patent #:
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Issue Dt:
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09/12/2000
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Application #:
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09050666
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Filing Dt:
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03/30/1998
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Title:
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METHOD OF MAKING INTEGRATED CIRCUIT PACKAGE HAVING ADHESIVE BEAD SUPPORTING PLANAR LID ABOVE PLANAR SUBSTRATE
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Patent #:
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Issue Dt:
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12/19/2000
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Application #:
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09078377
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Filing Dt:
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05/13/1998
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Title:
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INTEGRATED CIRCUIT CHIP TO SUBSTRATE INTERCONNECTION
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Patent #:
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Issue Dt:
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11/21/2000
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Application #:
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09083524
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Filing Dt:
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05/22/1998
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Title:
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RF SHIELDED DEVICE
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Patent #:
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Issue Dt:
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11/07/2000
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Application #:
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09103760
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Filing Dt:
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06/24/1998
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Title:
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PLASTIC INTEGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
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Patent #:
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Issue Dt:
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07/25/2000
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Application #:
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09141936
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Filing Dt:
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08/28/1998
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Title:
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ELECTROMAGNETIC INTERFERENCE SHIELD DRIVER AND METHOD
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Patent #:
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Issue Dt:
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09/26/2000
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Application #:
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09161189
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Filing Dt:
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09/25/1998
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Title:
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CARRIER STRIP AND MOLDED FLEX CIRCUIT BALL GRID ARRAY
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Patent #:
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Issue Dt:
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11/07/2000
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Application #:
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09176048
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Filing Dt:
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10/20/1998
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Title:
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A METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE EMPLOYING A TRANSPARENT ENCAPSULANT
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Patent #:
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Issue Dt:
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09/05/2000
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Application #:
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09199706
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Filing Dt:
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11/24/1998
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Title:
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METHOD FOR FORMING ISOLATION TRENCHES ON A SEMICONDUCTOR SUBSTRATE
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Patent #:
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Issue Dt:
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11/21/2000
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Application #:
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09203720
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Filing Dt:
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12/01/1998
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Title:
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GRID ARRAY TYPE LEAD FRAME HAVING LEAD ENDS IN DIFFERENT PLANES
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Patent #:
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Issue Dt:
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10/17/2000
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Application #:
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09220987
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Filing Dt:
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12/23/1998
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Title:
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METHOD FOR CALIBRATING OPTICAL SENSOR USED TO MEASURE THE
TEMPERATURE OF A SUBSTRATE DURING RAPID THERMAL PROCESS
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Patent #:
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Issue Dt:
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07/18/2000
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Application #:
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09222226
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Filing Dt:
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12/29/1998
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Title:
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BUMP CHIP SCALE SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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03/13/2001
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Application #:
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09223236
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Filing Dt:
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12/30/1998
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Title:
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MOS TRANSISTOR THAT INHIBITS PUNCHTHROUGH AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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07/18/2000
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Application #:
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09223458
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Filing Dt:
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12/30/1998
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Title:
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MASKING PROCESS FOR FORMING SELF-ALIGNED DUAL WELLS OR SELF-ALIGNED FIELD-DOPING REGIONS
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Patent #:
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Issue Dt:
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03/20/2001
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Application #:
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09223471
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Filing Dt:
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12/30/1998
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Title:
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TRENCH STRUCTURE FOR ISOLATING SEMICONDUCTOR ELEMENTS AND METHOD FOR FORMING THE SAME
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Patent #:
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Issue Dt:
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03/06/2001
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Application #:
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09420065
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Filing Dt:
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10/18/1999
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Title:
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THIN LEADFRAME-TYPE SEMICONDUCTOR PACKAGE HAVING HEAT SINK WITH RECESS AND EXPOSED SURFACE
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Patent #:
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Issue Dt:
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09/12/2000
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Application #:
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09422008
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Filing Dt:
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10/20/1999
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Title:
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OPTICAL SENSOR ARRAY MOUNTING AND ALIGNMEMT
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|
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Patent #:
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Issue Dt:
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03/13/2001
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Application #:
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09591705
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Filing Dt:
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06/09/2000
|
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Title:
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Making solder ball mounting pads on substrates
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