Patent Assignment Details
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| Reel/Frame: | 011754/0993 | |
| Pages: | 4 |
| | Recorded: | 04/30/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/04/2003
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Application #:
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09844727
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Filing Dt:
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04/30/2001
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Title:
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DEPOSITING AN ADHESION SKIN LAYER AND A CONFORMAL SEED LAYER TO FILL AN INTERCONNECT OPENING
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Assignee
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| ONE AMD PLACE |
| SUNNYVALE, CALIFORNIA 94088 |
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Correspondence name and address
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MONICA H. CHOI, LAW OFFICES
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MONICA H. CHOI
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P.O. BOX 3424
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DUBLIN, OH 43016-0204
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