Patent Assignment Details
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| Reel/Frame: | 011772/0386 | |
| Pages: | 2 |
| | Recorded: | 04/25/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/24/2002
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Application #:
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09843096
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Filing Dt:
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04/25/2001
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Publication #:
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Pub Dt:
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05/30/2002
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Title:
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HEAT SINK WITH COOLING FINS FOR SEMICONDUCTOR PACKAGE
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Assignee
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| 416, MAETAN-DONG, PALDAL-GU |
| SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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SKJERVEN MORRILL MACPHERSON LLP
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ELAINE H. LO
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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