Patent Assignment Details
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| Reel/Frame: | 011786/0070 | |
| Pages: | 5 |
| | Recorded: | 05/07/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/24/2009
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Application #:
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09712749
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Filing Dt:
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11/14/2000
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Title:
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LOW PROFILE INTEGRATED MODULE INTERCONNECTS AND METHOD OF FABRICATION
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Assignee
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| INTELLECTUAL PROPERT DEPT. |
| 1303 EAST ALGONQUIN ROAD |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA, INC.
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INTELLECTUAL PROPERTY DEPT.
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WILLIAM E. KOCH
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SUITE R3163, P.O. BOX 10219
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SCOTTSDALE, AZ 85271-0219
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