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Patent Assignment Details
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Reel/Frame:011802/0928   Pages: 2
Recorded: 05/14/2001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
09775605
Filing Dt:
02/05/2001
Publication #:
Pub Dt:
10/04/2001
Title:
Method for forming interconnect structure in semiconductor device
Assignor
1
Exec Dt:
03/15/2001
Assignee
1
7-1 SHIBA 5-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondence name and address
YOUNG & THOMPSON
MARGOT RUFF
SECOND FLOOR
745 SOUTH 23RD STREET
ARLINGTON, VA 22202

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