Patent Assignment Details
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| Reel/Frame: | 011817/0551 | |
| Pages: | 3 |
| | Recorded: | 05/16/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/24/2002
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Application #:
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09855529
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Filing Dt:
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05/16/2001
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Publication #:
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Pub Dt:
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11/22/2001
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Title:
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SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RESIN MOLDING DIE, AND SEMICONDUCTOR MANUFACTURING SYSTEM
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Assignee
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| 72 HORIKAWA-CHO, SAIWA-KU |
| KAWASAKI-SHI, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, GARRETT &
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DUNNER, L.L.P.
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MR. ERNEST F. CHAPMAN
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1300 I STREET, N.W.
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WASHINGTON, DC 20005-3315
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