Patent Assignment Details
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| Reel/Frame: | 011824/0470 | |
| Pages: | 3 |
| | Recorded: | 05/21/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/28/2005
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Application #:
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09819181
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Filing Dt:
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03/27/2001
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Publication #:
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Pub Dt:
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10/03/2002
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Title:
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Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via
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Assignee
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| 5666 LA RIBERA STREET |
| LIVERMORE, CALIFORNIA 94550 |
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Correspondence name and address
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SMITH-HILL AND BEDELL, P.C.
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PENELOPE STOCKWELL
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12670 N.W. BARNES ROAD
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SUITE 104
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PORTLAND, OREGON 97229
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