Patent Assignment Details
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Reel/Frame: | 011856/0457 | |
| Pages: | 4 |
| | Recorded: | 05/31/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/12/2004
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Application #:
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09867438
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Filing Dt:
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05/31/2001
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Publication #:
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Pub Dt:
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08/29/2002
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Title:
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SEMICONDUCTOR DIE PACKAGE HAVING MESH POWER AND GROUND PLANES
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Assignee
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46539 FREMONT BOULEVARD |
FREMONT, CALIFORNIA 94538 |
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Correspondence name and address
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MORGAN, LEWIS & BOCKIUS LLP
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JOHN D. ZELE
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1800 M STREET NW
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WASHINGTON, D.C. 20036
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