Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 011951/0339 | |
| Pages: | 3 |
| | Recorded: | 06/27/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2003
|
Application #:
|
09893074
|
Filing Dt:
|
06/27/2001
|
Publication #:
|
|
Pub Dt:
|
11/01/2001
| | | | |
Title:
|
METHOD OF FABRICATING A SEMICONDUCTOR CHIP PACKAGE WITH A LEAD FRAME AND MULTIPLE INTEGRATED CIRCUIT CHIPS
|
|
Assignee
|
|
|
NO.4, R & D 3RD ROAD, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU CITY, TAIWAN |
|
Correspondence name and address
|
|
CHRISTIE, PARKER & HALE, LLP
|
|
D. BRUCE PROUT
|
|
P.O. BOX 7068
|
|
PASADENA, CA 91109-7068
|
Search Results as of:
05/22/2024 12:54 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|